7307.BGA SNR Soldering Paste for BGA Applications
- Payment by invoice possible
- Not currently in stock, contact us for factory lead times
- Payment by invoice possible
- In stock at factory, ready to ship in estimated 1-2 weeks, contact us for expedited options
- Del Rey is proud to be the exclusive distributor of Waagene products
- Payment by invoice possible
- Low quantities typically kept on hand; please contact us for availability at lead time
- Authorized MiniBOOSTER distributor & hydraulic excellence partner
Product Description
The 7307.BGA SNR is a high-quality soldering paste specifically formulated for Ball Grid Array (BGA) applications. Designed to meet the stringent demands of modern electronics manufacturing processes, this soldering paste ensures reliable connections for delicate BGA components. Its unique formulation provides excellent wetting properties, ensuring uniform spreading and adhesion to the PCB surface. The 7307.BGA SNR offers a high level of thermal stability, preventing solder ball coalescence and ensuring precise reflow soldering.
This soldering paste is easy to apply, enabling efficient and accurate application on BGA pads. Its low voiding characteristics enhance solder joint reliability, essential for critical electronic applications. The 7307.BGA SNR is suitable for a wide range of BGA components, making it a versatile choice for electronic assembly tasks. Whether used in prototype development or high-volume production, this soldering paste delivers consistent results and facilitates the assembly of complex electronic systems with confidence. Trust the 7307.BGA SNR for your BGA soldering needs, ensuring precision, reliability, and performance in every application.